ECI – The industry standard for wet metallization processes
The most trusted name in plating analysis and control, since the birth of the modern logic chips.
Plating, or deposition, is a critical and demanding step in the semiconductor manufacturing process. A microscopic layer of Copper or other metals is deposited onto tiny circuitry pathways, interconnecting transistors and components. With shrinking computer chips, the dimensions of these pathways become smaller and less tolerant of deviations.
After the many manufacturing steps required to go from Silicon to wafer – overplating or underplating by the slightest margins can result in voids, producing some very expensive waste. ECI’s QUALI-LINE products enable online monitoring and precise control of the process.