Enabling Your Panel/IC Substrate Technologies

Panel / IC Substrate Packaging includes processes of Desmear, PTH, E-Less or electroplating Cu, and Final Finishes. To meet the challenges of Panel / IC Substrate packaging, it is critical that these processes are controlled and monitored. Together with the leading chemical and equipment suppliers, ECI has developed a complete suite of metrology methods enabling Panel / IC Substrate Packaging technologies.

ECI offers turn-key solutions for fully automated on-line chemical monitoring and control of IC substrates/Panel Packaging manufacturing.