Copper and Silver wires are rapidly gaining a foothold as interconnection materials in semiconductor packaging applications because of their advantages over gold. These advantages include up to 90% cost reduction, superior electrical and thermal conductivity, less intermetallic growth, greater reliability of the bond at elevated temperatures and higher mechanical stability. One of the disadvantages of copper wires is that copper tends to undergo oxidation at relatively low temperatures.

Sequential Electrochemical Reduction Analysis (SERA) can measure copper oxidation and thus help study and optimization of wirebonding processes utilizing copper wire. Incorporating proven techniques, QC-200 can analyze pure copper as well as copper protected with OSP. QC-200 can help you understand how, when and how much oxidation appears on your wires under different conditions and types of atmospheres.

• Quantitatively detect Copper Oxides and other reducible species
• Analyze Cu and Ag wire diameters between 15μm – 250μm
• Measures type and thickness of Oxides or Sulfides
• Superior accuracy and precision
• Supports wire spools and modified electrical connectors

 

• Detect and measure Copper Oxides and other reducible species on Copper wire surface
• Study the mechanism and rate of Oxide growth in different temperatures and atmospheres (air, forming gas, Nitrogen, etc.)
• Analysis of Silver wires
• Analysis of Gold wires
• Great for wire manufacturers, assemblers, and wirebonders