Quali-Fill Chemical Management System provides analysis and dosing for Electroplating or Electroless TSV and Wafer Level Packaging (WLP) applications. Quali-Fill systems feature a modular design capable of maintaining entire Bump, RDL, UBM, or Cu Pillar processes. The system consists of a Master module and one or more Satellite modules, controlled by the Master. Each module is dedicated for analysis of a specific chemsitry, such as Cu, SnAg, Ni, or Au. Quali-Fill can be extended in the field by adding Satellite modules for additional chemistries. Coupled with Quali-Dose, the system automatically manages your plating processes with maximum efficiency. It is qualified as “Process Of Record” in the world’s most advanced semiconductor manufacturing facilities.
Supports all major chemistries
Modular, expandable, flexible
Field-proven in high volume manufacturing and R&D
Seamless integration with plating tool
Comprehensive analysis of all components:
- metals
- acids
- complexing agents
- surfactants
- grain refiners
- pH
- specific gravity
Automatic calibration and validation of results
Reagents compatible with plating solutions
Non-hazardous waste
Analytical techniques are integrated based on CoO and desired specifications
Analytical techniques:
- CVS (Cyclic Voltametric Stripping)
- Titration
- Spectroscopy (UV-Vis, NIR)
- Non-Reagent Potentiometry
- Dissolved Oxygen
- Extractions
| Plating Bath | Component | Accuracy | Repeatability |
|---|---|---|---|
| Electrolytic Applications | |||
| Copper Inorganic | Cu | 3% | 3% |
| Chloride | 3% | 2% | |
| Sulfuric Acid | 3% | 2% | |
| Copper Organic | Accelerator | 5% | 4% |
| Suppressor | 5% | 4% | |
| Leveler | 5% | 4% | |
| Tin Silver | Sn | 5% | 5% |
| Silver | 5% | 4% | |
| Acid | 4% | 3% | |
| Primary | 5% | 4% | |
| Secondary | 5% | 4% | |
| Complexer | 5% | 4% | |
| Nickel | Ni | 3% | 2% |
| Anode Activator | 3% | 2% | |
| Boric Acid | 3% | 2% | |
| Wetting Agent | 5% | 4% | |
| pH | 0.1pH | 0.05pH | |
| Gold | Au | 5% | 5% |
| SO3 | 5% | 4% | |
| Specific Gravity | 0.01g/cm3 | 0.01g/cm3 | |
| pH | 0.1 | 0.1 | |
| Palladium | Pd | 5% | 4% |
| Additive A | 5% | 4% | |
| pH | 0.1 | 0.1 | |
| Electroless Applications | |||
| Cleaner | MCL 10 | 5% | 5% |
| Activator | MCT 14 | 5% | 5% |
| H2SO4 | 0.2% | 0.1% | |
| E-less Cobalt | Cobalt | 3% | 3% |
| pH | 0.1 | 0.05 | |
| E-less Nickel | Ni | 2% | 2% |
| pH | 0.1 | 0.05 | |
| E-less Gold | Au | 7.5% | 5% |
| TDS-20-A | 5% | 5% | |
| TDS-20-M5 | 7.5% | 5% | |
| pH | 0.1 | 0.05 | |
| E-less Palladium | Pd | 5% | 5% |
| Complexing Agent | 10% | 10% | |
| Reducing Agent | 10% | 10% | |
| pH | 0.1 | 0.05 | |
| E-less Flash Gold | Au | 5% | 5% |
| Complexing Agent | 5% | 5% | |
| Reducing Agent | 10% | 10% | |
| pH | 0.1 | 0.05 | |
| E-less Heavy Gold | Au | 3% | 3% |
| Complexing Agent | 5% | TBD | |
| Reducing Agent | 5% | TBD | |
| pH | 0.1 | 0.05 | |
