SERA answers Solderability and Wirebondability questions. The ability to solder and wirebond is a critical factor in the manufacturing of reliable Semiconductor devices. Each mis-bonded component lands on the reject pile, either at your plant or your customers. Traditional techniques, like XRF, SEM, ESCA/Auger, Dip and Look, etc., tend to be subjective, time consuming, costly, and are often unreliable. Utilizing the patented technique known as SERA (Sequential Electrochemical Reduction Analysis), the SurfaceScan measures the adhesion characteristics of your surface. You’ll know if you’re ready for bonding and if not you’ll know why!!!