Quali-Fill series is a combination of ECI’s unparalleled experience in manufacturing online chemical monitoring systems with dosing capabilities, created to address the growing need for precision metal plating in the solar industry. The modular system design maximizes flexibility and reliability to support electroplating and electroless metal deposition processes. Quali-Fill can manage multiple baths and their components simultaneously, driving yield up and significantly reducing operational costs. Taking your productivity to new levels – that’s ECI’s Quali-Fill!
Wide variety of proven analytical techniques for analysis of Cu, Sn, and Light Induced Ag:
- CVS and other voltammetric methods
- Titration, OCP, and other
- potentiometric methods
- Spectroscopy (UV-Vis-NIR)
- Tensiometry
- Coriolis Density measurement
- Separation methods
- Patented/Proprietary Techniques
- Multivariate Analysis
Flexible Dosing Regimes:
- Analytical Results
- Amp x Min
- Time Proportional
- Manual
- Supports Bleed and Feed, bath makeup, and DIW
Customized channels for different components
For complete equipment specifications and for additional information please contact your local sales representative or info@ecitechnology.com.
