Virtual and in-person conference San Diego, California
ECI Technology will present “Comprehensive Characterization of All Inorganic and Organic Components in Neutral Tin Plating Bath for Electronics Applications,” in the Materials/Packaging session.
Tin (Sn) and Sn alloy solder remain the dominant material for low-latency, high-bandwidth interconnect technology. Highly acidic electrolytes are traditionally used to achieve a fast deposition rate. The process is highly scalable and can be done on the micron-level scale as part of wafer-level processing (WLP) or panel-level packaging technology.
Eugene Shalyt, Vice President, Research and Development at ECI Technology, will explore a large number of individual additives that make process control for component deposition extremely challenging. Examples of additives and analysis methods will be presented.
Three areas of advancement in neutral pH Sn solution will be discussed, including:
- Analytical methods and harnessing data to improve process control strategies
- Comprehensive characterization of all inorganic and organic bath components
- System automation and continuous predictive diagnostics for high volume manufacturing
Examples of analysis of key components will be presented:
- Chelator, anti-whisker, and total conductive salts by NIR spectroscopy methods
- Brightener analyzed by surfactant titration
- Sn(II) analyzed by a proprietary electrochemical method (instead of the reduction/ oxidation titration) to eliminate the impact of antioxidant
ECI Technology will present “Electrochemical Express Analysis of Organic Additives in Tin and Tin-Silver Wafer-Level Packaging Plating Baths,” will be presented by Michael Pavlov, Director of Research and Development at ECI Technology.
Electroplating with lead-free alloys has become a common material in electronics manufacturing. Alloys containing tin (Sn), silver (Ag), and pure Sn are the most common. Analytical techniques for analyzing lead-free plating bath components have been developed along with faster analytical methods to control high-speed plating baths.
- The effect of changes in the concentration of organic components on the deposit structure was studied and will be presented.
- A new regeneration method for electrodes will also be presented
- Other parameters and steps of analysis were evaluated for potential reduction of the analysis time. Information related to the electrochemical behavior of organic additives at specific conditions when the analysis is performed at different speeds will be reviewed.
- The concentration of inorganic components and Ag complexing agents can be determined via non-reagent and virtually real-time spectroscopic analytical methods. The presentation will show the analytical results for several organic additives at different concentration levels.
About ECI Technology
ECI Technology is a leading provider of chemical process control equipment for the microelectronics industry. ECI systems are found throughout the fabs ‒ qualifying incoming supplies, managing tool inputs, adjusting chamber/bath conditions, and monitoring process waste ‒ and are widely accepted as critical enablers for the successful implementation of most “wet” processes.
ECI maintains a global sales and service organization that supports thousands of successful installations in major factories around the world. The organization provides comprehensive technical support, service, and training for all products. Staffing in every territory includes service and process engineers. In addition to a suite of standard products, ECI also develops customized solutions to meet application-specific customer requirements.
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