We use cookies to ensure that we give you the best experience on our website Close
  • Skip to primary navigation
  • Skip to main content
  • Skip to footer

ECI Technology | We Keep Your Chemistry Right

Leading Provider of Chemical Management Systems for Semiconductor, PV, and PCB Industries

  • Semiconductor
  • Printed Circuit Boards
  • Chemical Process Control
  • Company
    • About ECI Technology
    • Quality Policy
  • Products
    • Semiconductor
      • Surface-PreparationQUALI-SURF
      • InterconnectsQUALI-LINE
      • TSV & Wafer Level PackagingQUALI-FILL
      • IC Substrate & Panel PackagingQUALI-FILL
      • Coating CharacterizationSURFACE-SCAN
    • Printed Circuit Boards
      • PlatingQualiLab
      • PlatingQUALI-FILL LIBRA A
      • Surface Analysis and Coating CharacterizationSurface-Scan
    • Chemical Process Control
      • PV Texturing
      • PV Plating
  • Newsroom
  • Articles
  • Careers
  • Global Network
  • Support
  • Contact Us
  • Search

drabinovitch

International Interconnect Technology Conference 2022

by drabinovitch

ECI Technology will be participating in the IITC 2022 conference in San Jose. We will present “Express Metrology for sub 7nm Copper and Cobalt Damascene Plating Baths” during the event.

IITC 2022

Hope to see you there!

 

ECI Technology at SEMICON Korea 2022

by drabinovitch

Feb. 9, 2022 – Feb 11, 2022
Seoul, Korea

SEMICON Korea is the premier event for the Korean semiconductor and electronics manufacturing supply chain. The exhibition will showcase the latest semiconductor materials, equipment, and related technologies.

ECI Technology is supplying fully qualified chemical metrology for sub-10nm nodes to leading foundry, IDM, and equipment suppliers in the semiconductor industry. ECI Technology will display its Process Chemical Monitoring Systems that interface with advanced cleaning and etch tools as well as customized control solutions for new and established processes.

ECI Technology will feature its new proprietary QualiLab Elite® plating-bench chemical analyzer and ECI’s Chempack® computer software/parameters for chemical analysis.

ECI Technology Booth # B818

Visit the show website

Electrochemical Behavior and Analysis of Organic Additives in Modern Lead-Free Wafer Level Packaging Plating Baths

by drabinovitch

The following is a summary of one of the papers presented at the Americas International Meeting on Electrochemistry and Solid State Science (AiMES) 2018 conference on Electrochemical Behavior & Analysis of Organic Additives in Modern Lead-Free WLP Plating Baths
 

Tin-lead deposits provide excellent performance for bumping applications. However, this coating is being phased out because of environmental concerns. The two main commercial alternatives to tin-lead processes are pure tin and tin-silver. Recently similar formulations were released by a number of chemical suppliers. Compared to the Tin-lead process, there are additional components as well as new challenges for metrology. This presentation describes some of the analytical methods required for this project.

Analysis of Acid and Tin remained mainly the same as for the Tin-Lead process. Standard acid-base and red-ox titration provide good accuracy and reproducibility of analysis.

Silver can be determined by AA, but this method cannot be easily automated. Traditional titration or spectrophotometric methods for silver does not work in presence of complexer. We were able to overcome this obstacle by use of masking reagent.

Proper operation of the bath requires an excess of complexer, so that 100% of silver ions are complexed. We developed a unique titration method in which the position of knee-point on titration indicates the concentration of free complexer.

In order to control grain size, suppressive agents (grain refiner, surfactant, or both) are used. CVS method is at it best for such analysis. All of these analysis are available in QualiLab Elite. Analysis time 5-10 min. Accuracy 5-10%. Reproducibility within 5%.

 

Footer

ECI Technology

We Keep Your Chemistry Right™

Established in 1987, we boast thousands of satisfied customers worldwide. From R&D labs to high volume manufacturing environments, ECI’s products offer the best flexibility, accuracy, and reliability, where it matters most.

Important Links

  • Contact Us
  • Global Network
  • Career Opportunities
  • Support

Upcoming Events

International Interconnect Technology Conference 2022

ECI Technology at SEMICON Korea 2022

© ECI Technology 1987 - 2023 · All Rights Reserved

Terms and Conditions - Privacy Policy