ECI - The industry standard in Damascene
Plating, or deposition, is a critical and demanding step in the semiconductor manufacturing process. A microscopic layer of Copper or other metals is deposited onto tiny circuitry pathways, interconnecting transistors and components. With shrinking computer chips, the dimensions of these pathways become smaller and less tolerant of deviations. After the many manufacturing steps required to go from Silicon to wafer – overplating or underplating by the slightest margins can result in voids, producing some very expensive waste. ECI's Cu Damascene products enable online monitoring and precise control of the process.