ECI scientists Chuannan Bai, Eugene Shalyt, Guang Liang, Jingjing Wang, Michael McEwan, and Helen Liu co-authored a presentation entitled "Metrology for Post Etch Residue Removal", which was given at the 2016 Surface Preparation and Cleaning Conference, held on April 19-20 in Santa Clara,...
ECI's world-leading R&D scientists publish their latest findings in a short infographic entitled "Non Reagent Metrology for Modern TSV Copper Plating Baths." This information was presented on April 15th at the 2016 IEEE Workshop on Microelectronics and Electron Devices at Boise Sta...
Please click here to display in html format. Visit Us at Semicon Taiwan 2015 in Taipei, Sept 2-4 Booth #928 We will introduce the latest Chemical Metrology Focused on Solutions for the Challenges of 10...
ECI Technology scientists presented a technical paper on TMAH monitoring at the 12 International Symposiom on Ultra Clean Processing of Semiconductor Surfaces in Brussels, Belgium earlier this month. The presentation is available as an article here.
ECI Scientists presented new metrology developments for Ni electrodeposition at the ElectroChemical Society's biannual meeting in Cancun, Mexico. This major international conference offers a unique blend of electrochemical and solid-state science and technology; and serves as a major forum for t...
Special Invitation from ECI Technology Please click here to display in html format. Visit Us at Semicon Taiwan 2014 in Taipei City, Sept 3-5 Booth #912 We will introduce the latest E-Series A...
Special Invitation from ECI Technology, Inc. Please click here to display in html format. Visit Us at Semicon West 2014 in San Francisco, July 8-11 Booth #828 We will introduce the latest E-S...
Following a presentation on Monitoring of Wet Etch for Wafer Thinning and Via Reveal Process, Co-author and presenter Chuannan Bai of ECI's R&D department received the honor of "Best in Session". This was awarded as part of the Internation Microelectronics Assembly and Packaging So...
ECI will be exhibiting at Semicon West 2013, booth 731 in South Hall. Come by and be introduced to our new generation of Quali-Line Chemical Monitoring Systems, along with many other advancements in chemical metrology for Wafer Level Packaging, TSV, Clean and Etch processes, and more.
One of ECI's world class R&D chemists, Julia Tyutina, presented her analytical findings this month at the Pittcon Conference in Philadelphia. The topic covered monitoring of Dissolved Silicon in Si3N4 Etching solution. The presentation was well received at the conference, and the methods des...