News

Dec. 01
2017
ECI's next exhibit is at Semicon Japan 2017, Dec. 13-15, Booth #4828 in Tokyo. ECI Technology is the only company supplying fully qualified chemical metrology for sub-10nm nodes to leading foundry, IDM, and equipment suppliers in the Semiconductor industry! Please don't hesitate to stop by o...
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Jun. 07
2017
ECI's new subsidiary in Japan is the subject of an article on the Japan External Trade Organization (JETRO) website. ECI is proud to invest in Japan, which has been responsible for so much historic technological innovation, and around the world, including new subsidiary offices in South Korea an...
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Feb. 13
2017
ECI is proud to announce our successful recertification for the new ISO9001:2015 standard.  ECI continues to adhere to the highest international standards of quality and customer service protocols.
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Oct. 27
2016
Quali-Fill Chemical Management Systems for Wafer Level Packaging USA, October 27, 2016 – ECI Technology, Inc. announced it has received a multi-million dollar order from a major OSAT in Taiwan for Quali-Fill® Chemical Management Systems. ECI’s Quali-Fill systems provide fully automat...
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Aug. 27
2016
ECI is presenting "Metrology for High Selective Si Nitride Etch" at the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces in Knokke-Heist, Belgium.  ECI's world-leading R&D continues to contribute to the progress of modern semiconductor fabricati...
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Aug. 22
2016
ECI Technology’s Quali-Fill® E-系列是​​一款全新設計的即時化學分析系統。在ECI領先業界的化學監測技術上,Quali-Fill E-系列系統提供一個全自動化的化學品量測和智能型化學成分計量添加的功能。   Quali-Fill E-系列系統分析功能包括Copper Pillar, RDL, Micro-Bump和 UBM 製程溶液。Quali-Fill E-系列系統採用了最新的模組化設計,不但能夠同時支援多個化學槽,如Cu(銅)、SnAg(錫銀)、Sn(錫)、Ni(鎳)和 Au(金),還能夠任意擴充或新...
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May. 04
2016
ECI scientists Chuannan Bai, Eugene Shalyt, Guang Liang, Jingjing Wang, Michael McEwan, and Helen Liu co-authored a presentation entitled "Metrology for Post Etch Residue Removal", which was given at the 2016 Surface Preparation and Cleaning Conference, held on April 19-20 in Santa Clara,...
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Apr. 29
2016
ECI's world-leading R&D scientists publish their latest findings in a short infographic entitled "Non Reagent Metrology for Modern TSV Copper Plating Baths." This information was presented on April 15th at the 2016 IEEE Workshop on Microelectronics and Electron Devices at Boise Sta...
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Oct. 24
2014
ECI Technology scientists presented a technical paper on TMAH monitoring at the 12 International Symposiom on Ultra Clean Processing of Semiconductor Surfaces in Brussels, Belgium earlier this month. The presentation is available as an article here.
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Oct. 21
2014
ECI Scientists presented new metrology developments for Ni electrodeposition at the ElectroChemical Society's biannual meeting in Cancun, Mexico. This major international conference offers a unique blend of electrochemical and solid-state science and technology; and serves as a major forum for t...
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