Articles

Oct. 28
2014
Authored by Michael MacEwan, Jingjing Wang, Eugene Shalyt, Chuannan Bai, Guang Liang, Vishal ParekhPresented at the 12th Annual Symposium on Ultra Clean Processing of Semiconductor Surfaces in Brussels, Belgium, 2014. ECI Technology, Totowa, NJ 07512, USA Outline Project Goal Importance of TMAH in...
m
Oct. 25
2014
Authored by Eugene Shalyt, Jingjing Wang, Vishal Parekh, Michael MacEwanPresented at the ElectroChemical Society's 226th Biannual meeting in Cancun, Mexico, 2014. ECI Technology, Totowa, NJ 07512, USA Outline Use of Nickel Electrodeposition in Packaging Components of electrolyte and their funct...
m
Apr. 24
2006
Materials loss per cleaning cycle must be limited in advanced semiconductor process flows. Using dilute chemistries is necessary to achieve this goal. Fab engineers need to be able to analyze the concentrations of each component in processing solutions in real time to ensure that the chemistries are...
m
Apr. 23
2006
This paper reports the authors’  work on developing methods to analyze in-situ key parameters, including pH, nickel concentration and reducing agent concentration of electroless nickel baths. The purpose is to enable production line automated control of the deposition proce...
m
Apr. 16
2004
The mercaptopropylsulfonic acid (MPS) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be detected by cyclic voltammetric stripping (CVS) analysis. In the presence of oxygen, MPS decomposes rapidly...
m
Apr. 17
2003
Ingredients of commercial SolderOn SC and SolderOn BP chemistry as well as samples of aged solutions were provided by Shipley Company. Reagents used were from Aldrich.  Abstract  Typical bumping process includes formation of bumps through UBM copper electrodeposition, followed by depositio...
m
Mar. 01
2003
Overview With damascene processing gaining acceptance in high-volume IC manufacturing, reliable analysis of copper plating baths is increasingly important. Cyclic voltammetric stripping has shown that it is an accurate and precise method for the control of the organic additives. The latest generatio...
m
Mar. 03
2000
Use of electroplated copper for onchip metallization in ultra-largescale integrated circuits (ULSI) devices is gaining momentum because of the low cost and high throughput of the process. Electroplated lines and trenches with submicron dimensions, however, are strongly affected by changes in the com...
m
May. 01
1999
Over the years, the hot air solder leveling (HASL) process has been established as a primary surface finish for circuit boards. It still remains the most solderable, and arguably the most durable, surface finish. Recent developments in PCB manufacturing have highlighted some problems with these...
m
Apr. 17
1998
  Peter Bratin, Michael Pavlov and Eugene Shalyt ECI Technology, Totowa, NJ, USA ABSTRACT Immersion gold coating is a one of the major metallic alternative finishes used to replace tin/lead hot air finish. The immersion process provides flat coating over the substrate and do not introduce...
m